Polishing material for semiconductor devices "PLANERLITE"
A polishing material suitable for those seeking "high purity, high processing efficiency, high dispersion, and scratch-free."
The "PLANERLITE" series is a polishing material used in CMP (Chemical Mechanical Planarization) technology incorporated into the planarization process of increasingly dense ULSI devices. It is developed with the basic concepts of high purity, high processing efficiency, high dispersion, and scratch-free performance. [Introduction to the PLANERLITE Series] ■ PLANERLITE-4000: Polishing material for SiO2 films (interlayer insulating films, STI) ■ PLANERLITE-6000: Polishing material for Poly-Si ■ PLANERLITE-7000: Polishing material for copper wiring used in damascene processes ■ PLANERLITE-8000: Polishing material for barrier metals used in copper wiring *For more details, please refer to the PDF document or feel free to contact us.
- 企業：フジミインコーポレーテッド
- 価格：Other
